- Academic Advisor, Chemical Engineering
- Staff, Chemical Engineering
- MS, Chemical Engineering, Michigan Technological University
- BS, Chemical Engineering, Michigan Technological University
- Torrey, K., W. Yrjana, and J. King.Effect of Thermally Conductive Fillers on the Internal
Bond Strength of Waferboard. Forest Prod. J., Nov/Dec 2003.
- Hein, G., K. Torrey, J. Hertel, D. Oppliger, J. Keith, and G. Archer. Integrating
Engineering Disciplines into a Common First Year Engineering Program. ASEE Conference
Proceedings, June 2003.
- Torrey, K. Influence of Thermally Conductive Fillers on the Physical Properties of
Waferboard. M.S. Thesis, Advisor Dr. Julie King, Michigan Technological University,