Location
Minerals and Materials Engineering Building (M&M) 432
Contact
906-487-2058
Access Type
Description
The Perkin-Elmer sputtering tool has the ability to have up to three different 6” targets loaded at one time. The tool uses an RF power source for sputtering and currently has argon, and oxygen for reactive sputtering.
Available facilities
- Argon and oxygen
- Targets: Ti, SiO2, ITO, Cr, Au, Mo, Al, Si, MgO, ZnO, and Cu
- Dry nitrogen
- Solvents for cleaning samples
- < 4” wafers with reliable uniformity