Professional Development Committee

The Student Affairs and Advancement Professional Development Committee provides opportunities and resources to enrich the professional growth of student affairs staff members through a wide range of development opportunities including: professional presentations and webinars, technology training, book discussion group, and the rotating bi-annual Professional Development Day and Technology Day conferences.

 

Upcoming Events

Hardwiring Happiness Book Cover

Book Discussion Group

  • Apr 25, 2014 11:00 AM – 12:00 PM
  • MUB Alumni Lounge B

This semester's book is Hardwiring Happiness: The New Brain Science of Contentment, Calm, and Confidence by Rick Hanson. (The book is available on Amazon here.)The dates for the discussion groups are Friday, April 25 at 11am, and Tuesday, April 29 at 4pm, both in MUB Alumni Lounge B. Please mark your calendars and plan to attend one of these discussions. Happy Reading! If you have any questions, contact Susan Sullivan . . . [read more]

Hardwiring Happiness Book Cover

Book Discussion Group

  • Apr 29, 2014 4:00 PM – 05:00 PM
  • MUB Alumni Lounge B

This semester's book is Hardwiring Happiness: The New Brain Science of Contentment, Calm, and Confidence by Rick Hanson. (The book is available on Amazon here.)The dates for the discussion groups are Friday, April 25 at 11am, and Tuesday, April 29 at 4pm, both in MUB Alumni Lounge B. Please mark your calendars and plan to attend one of these discussions. Happy Reading! If you have any questions, contact Susan Sullivan . . . [read more]

Professional Development Day Logo

Professional Development Day 2014

  • May 20, 2014 12:00 PM – All Day
  • Multiple Locations

A day of opportunities provided for faculty and staff to improve their technical skills and knowledge through technology training sessions. The sessions are led by Michigan Tech faculty and staff and provide development in a learning-centered peer-to-peer environment. For more information visit the Professional Development Day website. . . . [read more]