- BS Metallurgical Engineering 1975
Anderson developed a lead-free solder alloy consisting of tin, silver, and copper that was patented in the United States in 1996 and 2001. In addition to its environmental advantages, Anderson's lead-free solder offers a lower melting temperature and greater strength than other lead-free solder alternatives. These properties are especially important in prolonged high-heat conditions, such as those found in computers and cell phones.
"My fundamental training at Tech gave me the curiosity and courage to question the established phase diagram for tin-silver-copper, which eventually led to the discovery of our basic lead-free solder alloy," Anderson said. read more at http://www.admin.mtu.edu/urel/magazine/winter06/association.html
Excerpted from Michigan Tech Magazine, Winter 2006-2007