Shiyan Hu

Shiyan Hu

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Associate Professor, Electrical and Computer Engineering

  • PhD, Computer Engineering, Texas A&M University

Biography

Professor Shiyan Hu received his Ph.D. in Computer Engineering from Texas A&M University in 2008. He is currently an Associate Professor in the Department of Electrical and Computer Engineering at Michigan Technological University, where he is the Director of Michigan Tech VLSI CAD Research Lab . He has been a Visiting Professor at IBM Research (Austin) during Summer 2010. His research interests are in the area of Computer-Aided Design of VLSI Circuits and Smart Home Cybersecurity, and he has published over 70 technical papers in the refereed journals and conferences. He is a recipient of ACM SIGDA Richard Newton DAC Scholarship (as the faculty advisor), a recipient of Faculty Invitation Fellowship from Japan Society for the Promotion of Science (JSPS), and a recipient of the National Science Foundation (NSF) CAREER Award. Prof. Hu’s ultra fast slew buffering technique has been widely deployed in industry. As an example, it became a default option in the IBM physical synthesis flow for designing various microprocessors and ASICs such as IBM flagship chip POWER 7 and it can accelerate the traditional buffering technique by over 100 times. His microfluidic biochip physical synthesis research was featured in the front cover of IEEE Transactions on Nanobiosciences in March 2014, which has been highlighted in IEEE Spectrum, Communications of ACM, Science Daily, Daily News and various other media. He is among 62 researchers selected from the European Union and the United States to attend the EU-US Frontiers of Engineering Symposium of National Academy of Engineering in 2014. His papers have been nominated for IEEE/ACM ICCAD William J. McCalla Best Paper Award in 2009 and IBM Pat Goldberg Best Paper Award in 2008 and 2010. Prof. Hu is an Associate Editor for IEEE Transactions on Circuits and Systems, and Guest Editor for IEEE Transactions on Industrial Informatics and ACM Transactions on Embedded Computing Systems. He has served as General Co-Chair and Technical Program Committee (TPC) Chair for ACM SIGDA DAC Ph.D. Forum in 2014 and 2013, respectively, as TPC Subcommittee Chairs for the premier conferences IEEE/ACM Design Automation Conference (DAC) in 2014 and 2015 and IEEE/ACM International Conference on Computer Aided Design (ICCAD) in 2011, and as TPC members for a number of conferences such as DAC, ICCAD, ISPD, ICCD and ISQED. He is a Senior Member of IEEE.

Areas of Interest

  • Computer-aided design of VLSI circuits, smart home cybersecurity, and combinatorial optimizations