- EERC 518
Associate Professor, Electrical and Computer Engineering
Associate Director, Michigan Tech Institute of Computing and Cybersystems
Director, Michigan Tech ICC Cyber-Physical Systems Research Center
- PhD, Computer Engineering, Texas A&M University
Professor Shiyan Hu received his Ph.D. in Computer Engineering from Texas A&M University in 2008. He is an Associate Professor in the Department of Electrical and Computer Engineering at Michigan Tech., where he is Director of Michigan Tech Cyber-Physical System Research Group, Associate Director of Michigan Tech Institute of Computing and Cybersystems, and Director of the Michigan Tech VLSI CAD Research Lab. He was a Visiting Professor at IBM Research (Austin) during Summer 2010. He is currently a Visiting Associate Professor at Stanford University.
Prof. Hu’s research interests include Cyber-Physical Systems, Cybersecurity, Computer-Aided Design of VLSI Circuits, and Embedded Systems, where he has published about 100 refereed papers, including 20+ in the premier IEEE Transactions. His research was featured in the Front Cover of IEEE Transactions on Nanobioscience in March 2014, and his papers have been nominated for IEEE/ACM ICCAD William J. McCalla Best Paper Award in 2009 and IBM Pat Goldberg Best Paper Award in 2008 and 2010. His ultra fast slew buffering technique has been widely deployed in industry, and as an example it was used in the IBM physical design flow for designing over 50 microprocessors and ASIC chips including IBM flagship chips POWER 7 and 8. His research has been highlighted in various public media such as CBS, IEEE Spectrum, Communications of ACM, Science Daily and PC World.
Prof. Hu is the Founding Chair for IEEE Technical Committee on Cybernetics for Cyber-Physical Systems. He is an ACM Distinguished Speaker, an IEEE Computer Society Distinguished Visitor, a recipient of National Science Foundation (NSF) CAREER Award, a recipient of ACM SIGDA Richard Newton DAC Scholarship (as the faculty advisor), an invited participant for Frontiers of Engineering Symposium by U.S. National Academy of Engineering, and a recipient of Faculty Invitation Fellowship from Japan Society for the Promotion of Science (JSPS). He is an Associate Editor/Guest Editor for 5 IEEE/ACM Transactions including IEEE Transactions on Computers, IEEE Transactions on CAD, IEEE Transactions on Circuits and Systems, IEEE Transactions on Industrial Informatics and ACM Transactions on Embedded Computing Systems. He has served as General Chair, Technical Program Committee (TPC) Chair, TPC Subcommittee Chair, Session Chair, and TPC Member for various conferences for more than 70 times, which include the TPC Subcommittee Chair for DAC and ICCAD. He is a Senior Member of IEEE.
Areas of Interest
- Cyber-Physical Systems
- Smart Home System and Cybersecurity
- Embedded System Design
- Microfluidic Biochip Computer Aided Design
- Computer Aided Design for VLSI/Nano Circuits