Shiyan Hu

Shiyan Hu

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Associate Professor, Electrical and Computer Engineering

Co-Director, Michigan Tech Institute of Computing and Cybersystems

Director, Michigan Tech ICC Cyber-Physical Systems Research Center

  • PhD, Computer Engineering, Texas A&M University

Biography

Professor Shiyan Hu received his Ph.D. in Computer Engineering from Texas A&M University in 2008. He is currently an Associate Professor in the Department of Electrical and Computer Engineering at Michigan Technological University, where he is Director of the Michigan Tech Cyber-Physical System Research Group, Co-Director of Michigan Tech Institute of Computing and Cybersystems, and Director of the Michigan Tech VLSI CAD Research Lab. He was a Visiting Professor at IBM Research (Austin) during Summer 2010, and he is a Visiting Associate Professor at Stanford University starting 08/2015. Prof. Hu’s research interests include Computer-Aided Design of VLSI Circuits, Embedded Systems, Cyber-Physical Systems and Cybersecurity, where he has published about 100 refereed papers, including 20+ in the premier IEEE Transactions. His microfluidic biochip physical design paper was featured in the Front Cover of the premier IEEE Transactions on Nanobioscience in March 2014, and his papers have been nominated for IEEE/ACM ICCAD William J. McCalla Best Paper Award in 2009 and IBM Pat Goldberg Best Paper Award in 2008 and 2010. His research has been highlighted in various public media such as CBS, IEEE Spectrum, Communications of ACM, Science Daily, PC World, Daily News and Biotech Daily.

Prof. Hu is the Founding Chair for IEEE Technical Committee on Cybernetics for Cyber-Physical Systems. He is an ACM Distinguished Speaker, a recipient of ACM SIGDA Richard Newton DAC Scholarship (as the faculty advisor), a recipient of Faculty Invitation Fellowship from Japan Society for the Promotion of Science (JSPS), and a recipient of the National Science Foundation (NSF) CAREER Award. He is an Associate Editor/Guest Editor for 5 IEEE/ACM Transactions including IEEE Transactions on Circuits and Systems, IEEE Transactions on Computers, IEEE Transactions on CAD, IEEE Transactions on Industrial Informatics and ACM Transactions on Embedded Computing Systems. He has served as General Chair, Technical Program Committee (TPC) Chair, TPC Subcommittee Chair, Session Chair, and TPC Member for various conferences for more than 70 times, which include the TPC Subcommittee Chair for DAC 2014, 2015 and ICCAD 2011. He is a Senior Member of IEEE.

Prof. Hu’s ultra fast slew buffering technique has been widely deployed in industry. As an example, it became a default option in the IBM physical design flow used for designing over 50 microprocessors and ASIC chips including IBM flagship chips POWER 7 and 8. He was among 62 researchers invited from the European Union and the United States to attend the EU-US Frontiers of Engineering Symposium of National Academy of Engineering in 2014. 

Areas of Interest

  • Cyber-Physical Systems
  • Smart Home System and Cybersecurity
  • Embedded System Design
  • Microfluidic Biochip Computer Aided Design
  • VLSI Computer Aided Design