Michele H. Miller
Professor, Mechanical Engineering–Engineering Mechanics
Peace Corps Master's International Coordinator
Engineering Education Innovation Research Group Director
- PhD, North Carolina State University
Dr. Miller has done research in the diverse fields of precision machining, micro-electromechanical systems and engineering education. She and her students have described the effects of wheel characteristics on the grinding of brittle materials, developed models of the vibration assisted grinding process, developed time-efficient analytical models of mass-resonant sensor dynamics for the purpose of design optimization, and advanced knowledge of the learning of hands-on ability.
Links of Interest
Areas of Expertise
- Engineering Education Research
- Precision Engineering
- Human Factors
- Self-directed learning
- Teaching and learning hands-on ability
- Vibration assisted grinding and water-jet assisted grinding
- Wheel wear and wheel loading mechanisms
- Machining of ceramics
- Dynamic behavior of micro-electromechanical systems (MEMS)
- Human factors in design
- Mahaddalkar, P. M. and M. H. Miller, “Force and Thermal Effects in Vibration Assisted Grinding,” International Journal of Advanced Manufacturing Technology, Vol. 71, 2014, pp. 1117-1122.
- Pereira, A. and M. H. Miller, “Gender Comparisons of Mechanical Aptitude, Prior Experiences, and Engineering Attitudes for Mechanical Engineering Students,” J. Women and Minorities Sci. and Eng., Vol. 18, No. 3, 2012, pp. 255-271. Read More
- Li, C. and M. H. Miller, “Optimization Strategy for Resonant Mass Sensor Design in the Presence of Squeeze Film Damping,” Micromachines, Vol. 1, No. 3, 2010, pp. 112-128. Read More
- Miller, M. H., J. A. Perrault, G. G. Parker, B. P. Bettig and T. G. Bifano, “Simple models for piston type micromirror behavior,” J. Micromechanics and Microengineering, Vol. 16, No. 2, 2006, pp. 303-313.
- Michele Miller, Fan, X., "Force Analysis for Grinding with Segmental Wheels," Machining Science and Technology, Vol. 10 (4), 435-455, 2006-00-00
- Lee, H., M. H. Miller and T. G. Bifano, “CMOS Chip Planarization by Chemical Mechanical Polishing for a Vertically Stacked Metal MEMS Integration,” J Micromechanics and Microengineering, Vol. 14, No. 1, 2004, pp. 108-115.