Michele H. Miller

Michele H. Miller


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Professor, Mechanical Engineering–Engineering Mechanics

Adjunct Professor, Materials Science and Engineering

Peace Corps Master's International Coordinator
Engineering Education Innovation Research Group Director

  • PhD, North Carolina State University


Dr. Miller has used analytical and experimental methods to develop models for the grinding of brittle materials. The goal is to develop techniques that improve material removal rates for the machining of brittle materials. Specifically, she and her students have investigated vibration assisted grinding and water-jet assisted grinding, as well as wheel wear and wheel loading mechanisms. Additional research interests include machine tool dynamics, optical micro-electromechanical systems (MEMS), and human factors in design.

Links of Interest

Areas of Expertise

  • Grinding
  • Precision Engineering
  • MEMS
  • Human Factors

Research Interests

  • Vibration assisted grinding and water-jet assisted grinding
  • Wheel wear and wheel loading mechanisms
  • Machining of ceramics
  • Machine tool dynamics
  • Optical micro-electromechanical systems (MEMS)
  • Human factors in design

Recent Publications

  • Michele Miller, Anna Pereira, "Gender Comparisons of Mechanical Aptitude, Prior Experiences, and Engineering Attitudes for Mechanical Engineering Student," Journal of Women and Minorities in Science and Engineering, Vol. 18, No. 3, pp. 255-271, 2012-00-00
  • Michele Miller, Chengzhang Li, "Optimization Strategy for Resonant Mass Sensor Design in the Presence of Squeeze Film Damping," Micromachines, Volume 1, Issue 3, 2010-10-27
  • Miller, M. H., J. A. Perrault, G. G. Parker, B. P. Bettig and T. G. Bifano, “Simple models for piston type micromirror behavior,” J. Micromechanics and Microengineering, Vol. 16, No. 2, 2006, pp. 303-313.
  • Michele Miller, Fan, X., "Force Analysis for Grinding with Segmental Wheels," Machining Science and Technology, Vol. 10 (4), 435-455, 2006-00-00
  • Lee, H., M. H. Miller and T. G. Bifano, “CMOS Chip Planarization by Chemical Mechanical Polishing for a Vertically Stacked Metal MEMS Integration,” J Micromechanics and Microengineering, Vol. 14, No. 1, 2004, pp. 108-115.
  • Salisbury, E. J., K. V. Domala, K. S. Moon, M. H. Miller and J. W. Sutherland, “A Three Dimensional Model for the Surface Texture in Surface Grinding, Part 2—Grinding Wheel Model,” Journal of Mfg Sci. and Engineering, Vol. 123, No. 4, 2001, pp. 582-590.
  • Qu, W., K. Wang, M. H. Miller, Y. Huang and A. Chandra, “Using Vibration Assisted Grinding to Reduce Subsurface Damage,” Precision Engineering, Vol. 24, No. 4, 2000, pp. 329-337